Broadcom announced it’s new generation combo chipset BCM4334 which integrates cellular signal module, WiFi signal module and Bluetooth signal module into a single SoC. Broadcom moved the chip from 60nm die in its predecessor to 40nm thus saving power consumption by great factor. The next generation iPhone is rumored to incorporate this new BCM4334 chip.
As part of the recent leaks supports more details about the next generation iPhone claiming a larger 4.0″ screen it was also learnt that the next generation iPhone will incorporate into it the new Broadcom BCM4334 chipset. The new chipset is supposed to consume 40%-50% lesser power in usage and around 70% lesser power in standby. If what Broadcom claims actually is true this will help the new iPhone in a great way.
The lesser power consumption by all wireless signals in a way support the larger screen to compensate the power requirement of the larger screen. Not only that, the new iPhone can now go for a slimmer battery and a slimmer design.
The new Broadband chip also supports Dual Band WiFi radio along with WiFi direct. Airdrop, a feature in OSX used for easy sharing of files between MACs is based on WiFi direct technology which was limited to MacBooks and iMacs till date, but with the inclusion of this new Broadband chip Apple might be looking into implementing Airdrop in iOS as well for the first time. Apple is known to create usable and intuitive interfaces, we are hoping that the new file sharing feature in iOS 6.0 will be easier than ever.